Nano Silver Servo Sintering Machine
1. Nanosilver sintering between chips and substrates of high-power semiconductor devices (IGBT modules) and wide bandgap semiconductors used in new energy vehicles, 5G/6G communications, and high-end equipment.
2. It has the characteristics of electrical conductivity, thermal conductivity, high bonding strength and high stability, and the module can work in a high temperature environment for a long time.
3. The equipment uses a heating tube to heat the heating element, and the heating element transfers heat energy to the template. The control adopts thermocouple closed-loop control, the maximum temperature is ≤350℃, and the surface temperature uniformity of the upper and lower plates is controlled at ±5℃
4. Vacuum degree <.-80kpa, vacuum time <.10S.
5. Equipment cooling method: air cooling + water cooling
6. Real-time display and storage of pressure, displacement, temperature, and time curves (for data traceability).
